A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract ...

The promised technology enables any standard 2D camera – such as those on smartphones, laptops or cars – to morph into 3D cameras that seamlessly merge the physical and digital world.

A new holographic camera technology can transform standard 2D cameras in smartphones, laptops, and cars into immersive, high-performance 3D cameras .

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

The work by researchers in the Center for Advanced Semiconductor Technologies could lead to energy-efficient microelectronics.

Sonair is pushing towards a new sensor built on 3D ultrasonic technology, giving autonomous robotics the power to see and make the right decisions.

3D IC technology is a significant advancement in the semiconductor industry, but there are still a number of unresolved issues and challenges that need to be addressed, said Cadence Design Systems.

Using the 3D IC technology, memory layers can be stacked to make a small 256Gb memory chip and even a terabit memory chip, according to Faris.