TI’s wafer fabrication plants produce semiconductor chips in a sterile environment, where a 400-step process takes place to turn 300mm wafers into some of the world’s most essential technology.

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Now, just over a year after the legislation was passed, Texas Instruments, a semiconductor company, broke ground on Thursday for its new 300 millimeter semiconductor wafer fabrication plant in Lehi.

300-mm manufacturing, Advanced Manufacturing, Capital Investment, CHIPS and Science Act, corporate expansion, fab, Governor Spencer Cox, LEED, Lehi, semiconductor wafer fabrication plant, Site ...

MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced it has assumed full operational control of the wafer fabrication ...

Meanwhile, after Tower Semiconductor and ISMC's wafer fab project fell apart, Tower Semiconductor sent a separate US$8 billion proposal to set up a project in March and has been waiting for ...

A rendering of early plans for Texas Instruments’ next 300-millimeter semiconductor wafer fab, next to the company's existing fab, in Lehi, Utah ...

Last week, Analog Devices, Inc. (ADI) celebrated a more than $1 billion investment to expand its semiconductor wafer fab in Beaverton, Oregon. Built in 1978, the Beaverton site is the global ...

The new Richardson fab brings the company’s 300 mm wafer facilities to four. Last year, the company added a Micron Technology Inc. semiconductor factory to its portfolio in a $900 million deal.

EQS-News: Elmos Semiconductor SE / Key word(s): Disposal/Agreement Elmos Semiconductor SE: Sale of Dortmund wafer fab to Littelfuse 28.06.2023 / 03:07 CET/CEST The issuer is solely responsible for ...

Rendering of early plans for Texas Instruments’ next 300-millimeter semiconductor wafer fab, next to the company's existing fab, in Lehi, Utah. Image courtesy of Texas Instruments.