Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company announced the investment on the same day it broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in the city-state.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,

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Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms, especially the

The main piece of news driving Micron stock higher was that Nvidia will be using Micron's high-bandwidth-memory (HBM) in its new GeForce RTX 50 Blackwell GPUs that undergird its new advanced AI platform.

For investors, both Amazon and Micron Technology offer a promising pathway to long-term returns, capitalizing on key trends shaping the future.

Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center expansion, and advancements in networking and memory chips. This optimism persists