Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising ...

The challenge lies in ensuring uniform wafer thickness, requiring nanoscale precision in laser focus depth. Thus, Si LAL ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

The company is expanding its “GaN ecosystem” with a new family of 650-V GaN power FETs, which feature a silicon-compatible ...

A new semiconductor startup, CDimension, has officially emerged from stealth with an ambitious goal: to reconstruct the ...

Solar cells and computer chips need silicon layers that are as perfect as possible. Every imperfection in the crystalline structure of a silicon wafer increases the risk of reduced efficiency or ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Deal Semiconductor has started shipping its first silicon devices based on a new architecture called SuperQ with lower losses.

Manufacturers’ Monthly spoke with Professor Brain Abbey from La Trobe University on the scale up manufacturing of ...

This latest triumph builds on previous successes by the Japanese company, which has shown that quartz-free HVPE can grow GaN layers with record room-temperature mobilities. Epilayers also feature very ...

Q2 2025 Earnings Call July 30, 2025 5:00 AM ET. Company Participants. Chi-Tung Liu - CFO, Senior VP, Head of Corporate Governance & ...

Most AI stocks at the moment are at nosebleed valuations. Even the names that once looked reasonable now trade at prices that ...