The challenge lies in ensuring uniform wafer thickness, requiring nanoscale precision in laser focus depth. Thus, Si LAL ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

Solar cells and computer chips need silicon layers that are as perfect as possible. Every imperfection in the crystalline structure of a silicon wafer increases the risk of reduced efficiency or ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Deal Semiconductor has started shipping its first silicon devices based on a new architecture called SuperQ with lower losses ...

This latest triumph builds on previous successes by the Japanese company, which has shown that quartz-free HVPE can grow GaN layers with record room-temperature mobilities. Epilayers also feature very ...

Probe Card Market growth is driven by rising semiconductor demand, 5G/IoT complexity, advanced MEMS probe card tech, automotive DRAM testing needs, and expand ...

Most AI stocks at the moment are at nosebleed valuations. Even the names that once looked reasonable now trade at prices that ...

Rigaku Corporation, a global solution partner in X-ray metrology systems and a Group company of Rigaku Holdings Corporation ...

At the SNEC expo, Carrie Xiao took the temperature of the industry as it seeks a way out of cutthroat competition and ...

Seamus Carroll, Vice President and Head of the Semiconductor Unit at IDA Ireland, believes Ireland is poised to lead the way, positioning itself as a centre for advanced chip design and manufacturing ...