The PCB now takes on additional responsibilities by incorporating fine-pitch redistribution layers (RDL) through advanced HDI ...

As we seek smaller chip geometries and better thermal performance, glass is emerging as a stable substrate material with excellent electrical properties. It’s inherently suited to additive circuit ...

Wolfspeed Inc. (NYSE:WOLF) is a semiconductor company that focuses on silicon carbide and gallium nitride/GaN technologies in Europe, Hong Kong, China, the rest of Asia-Pacific, the US, and ...

TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...

Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising ...

The global Silicon Carbide Nanoparticle Market is set to grow from USD 1.79 billion in 2025 to USD 5.71 billion by 2034, at a ...

TSMC’s exit from GaN fabrication is paving the way for IDM model to take over with a tight design-manufacturing coupling.

NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...

As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional ...

The silicon wafer demand for AI data-center chips, including high-bandwidth memory, continues to be very strong,” said Vice ...

MILPITAS, CA — Worldwide silicon wafer shipments increased 9.6% year-on-year to 3.33 billion square inches (MSI) from the 3.04 billion MSI recorded during the same quarter of 2024, the SEMI Silicon ...