The PCB now takes on additional responsibilities by incorporating fine-pitch redistribution layers (RDL) through advanced HDI ...

The global Silicon Carbide Nanoparticle Market is set to grow from USD 1.79 billion in 2025 to USD 5.71 billion by 2034, at a ...

TSMC’s exit from GaN fabrication is paving the way for IDM model to take over with a tight design-manufacturing coupling.

Aeluma Inc. (NASDAQ:ALMU) is one of the best performing semiconductor stocks to buy now. As May concluded, Aeluma, in ...

The silicon wafer demand for AI data-center chips, including high-bandwidth memory, continues to be very strong,” said Vice ...

A recent breakthrough is the use of artificial intelligence (AI), which learns how to manipulate atoms to improve a ...

Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging. The company plans ...

For PICs, silicon-on-insulator (SOI) wafers are preferred over conventional silicon wafers. SOI wafers are particularly advantageous because they include a thin silicon layer on top for crafting ...

In an interview before this week’s IEEE Electron Device Meeting (IEDM), Han Wui Then, principal engineer at Intel, described the use of engineered 300mm silicon substrates from Shin-Etsu Handotai for ...