Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising ...

The challenge lies in ensuring uniform wafer thickness, requiring nanoscale precision in laser focus depth. Thus, Si LAL ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

The company is expanding its “GaN ecosystem” with a new family of 650-V GaN power FETs, which feature a silicon-compatible ...

Solar cells and computer chips need silicon layers that are as perfect as possible. Every imperfection in the crystalline structure of a silicon wafer increases the risk of reduced efficiency or ...

Protein-based biotherapeutics are drugs made with genetically engineered proteins. These large protein molecules can stick ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Qualcomm Incorporated is shifting focus to edge AI, automotive, IoT, and more while maintaining strong growth. Click for more ...

Q2 2025 Earnings Conference Call July 31, 2025 8:30 AM ETCompany ParticipantsBenjamin Gliklich - CEO, President ...

This latest triumph builds on previous successes by the Japanese company, which has shown that quartz-free HVPE can grow GaN layers with record room-temperature mobilities. Epilayers also feature very ...

Australian solar PV module manufacturer Tindo Solar has partnered with UNSW to advance tunnel oxide passivated contact ...