The PCB now takes on additional responsibilities by incorporating fine-pitch redistribution layers (RDL) through advanced HDI ...

TSMC’s exit from GaN fabrication is paving the way for IDM model to take over with a tight design-manufacturing coupling.

Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising ...

The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide ...

Lasers that are fabricated directly onto silicon photonic chips offer several advantages over external laser sources, such as greater scalability. Furthermore, photonic chips with these ...

The University of California Santa Barbara has improved the integration of monolithic III-V lasers on silicon substrates.

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

Wolfspeed Inc. (NYSE:WOLF) is one of the tech stocks to buy according to analysts. On July 22, Susquehanna lowered the price target for Wolfspeed from $3 to $1.50, while maintaining a Neutral rating ...

Researchers grow single-crystal GaN films on amorphous glass using a chemically converted molybdenum nitride buffer, removing ...

NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...

This latest triumph builds on previous successes by the Japanese company, which has shown that quartz-free HVPE can grow GaN layers with record room-temperature mobilities. Epilayers also feature very ...