The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with ...

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

A new technical paper titled “SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology” was published by ...

A new technical paper titled “Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Successfully integrate components like MEMS and sensors by considering every aspect of the device from the outset.

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

The MEMS & Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor ...

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

A new technical paper titled “Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures” was published by ...