Semiconductor Packaging News
In 2025, the semiconductor market is set for growth, with analysts projecting a 20% increase as demand rebounds from recent declines. Despite geopolitical and economic uncertainties, the long-term outlook remains positive across key sectors, driven by demand from emerging markets within the Internet of Things (IoT) framework. ...
Semiconductor Packaging News
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain.
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News Index
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. ...
Eighteen New Semiconductor Fabs to Start Construction in 2025
2 days ago · The semiconductor industry will initiate 18 new fab construction projects in 2025, focusing on advanced logic and memory technologies. Driven by generative AI and automotive demand, capacity is forecast to grow 6.6% annually, surpassing 33 million wafers monthly ...
Semiconductor Packaging News
Three years on: Has India found its footing in the semiconductor industry? India launched an ambitious push into the global semiconductor industry on December 15, three years ago, aiming to break a seven-decade struggle.
Semiconductor Packaging News
U.S. launches new probe into legacy Chinese chips as tech pressure on Beijing escalates The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks.
Advanced Packaging: The Intensifying Strategic Game
The semiconductor industry is advancing with cutting-edge packaging technologies like 2.5D/3D, Chiplet, and FOWLP, delivering superior performance and integration. These innovations address AI, 5G, and HPC demands, reshaping competition and fueling rapid technological progress ...
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027 ...
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies: Summary The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S.